Canteliver Probe Card
MPI Cantilever Probe Card is greatly utilized on gold bump and pad wafer tests for Screen driver, logic, and memory device. MPI’s cantilever probes are the corresponding response into the demands of fine pitch, tiny pad dimensions, higher speed, fewer cleaning, multi-DUT, higher pin count, and ultra-minimal leakage prerequisites. With excellent craftsmanship, modern architecture and tested methodologies based on mechanical and electrical simulation/measurement outcomes, producing MPI the very best cantilever supplier around the globe.
FCB Probe Card
The FCB Probe Card is easily the most experienced technological know-how of buckling beam probe card. It is actually aimed to obtain the semiconductor ship manufacture time-to-market (TTM) and price of exam (COT) demand from customers. FCB is usually a tested solution for a number of semiconductor production checks from early engineering pilot-operates to substantial volume manufacturing (HVM). FCB is prepared for product necessitating large signal integrity probing (SI) and/or ability integrity probing (PI). Purposes include things like slicing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and a lot more. FCB guarantees the world’s most effective Over-all Expense-of-ownership (COO) for many DUT purposes.
EVS Probe Card
The EVS Probe Card is undoubtedly an enhancement about the traditional buckling beam probe card. Important options are better existing carrying capacity (C.C.C.) and decrease balanced Get hold of power (BCF), as well as Over-all MEMS-like qualities. EVS can certainly satisfy the need of Superior wafer probing. Exact alignment and fantastic planarity Management will be the vital aspects contributing to secure Get in touch with resistance. With its ability and performance, EVS Probe Card is an excellent option for Sophisticated probe playing cards.
Osprey probe card
The Osprey probe card is MPI’s Alternative to demand for ever finer pitch. It can be designed for smaller sized Al pad, which is perfect for tiny pitch application with peripheral and total array sample. With specific alignment and much better planarity Management, Osprey can access higher productivity by multi-DUT layout. The forming wire (FW) form needle produced with MPI’s personal micro fabrication method not merely provides significant-quality efficiency but in addition makes it possible for quick needle substitution and shortens maintaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is provided with MEMS wire (MW) needle which is designed for the demand of low force probing. Additionally, it comes with the ability to fulfill superior C.C.C. and superior pin counts software. The MEMS course of action makes certain remarkably regular needle attributes, along with the Particular structure design permits exact alignment and planarity Handle.
MPI more info probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/
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